| 1. | Research of rolling electroplate in electronic packaging 封装中的滚镀工艺研究 |
| 2. | Current status of research on electronic packaging materials 电子封装材料的研究现状 |
| 3. | The challenge of changeover to lead - free in electronic packaging 电子封装面临无铅化的挑战 |
| 4. | Application and development of cad in electronic packaging 技术在电子封装中的应用及其发展 |
| 5. | New progress of electronic packaging technology 电子封装技术的新进展 |
| 6. | A review of metal - martix composites for electronic packaging 电子封装用金属基复合材料的研究现状 |
| 7. | Present status and progress in study of electronic packaging materials 电子封装材料的研究现状及进展 |
| 8. | Review of metal - matrix composite materials for electronic packaging 金属基电子封装复合材料的研究进展 |
| 9. | Recent achievements in research for electronic packaging substrate materials 电子封装基片材料研究进展 |
| 10. | Sep standard electronic package 标准电子组件 |